摘 要

随着电子技术的快速发展，封装集成电路被大量应用于家电、汽车和航天等各种领域，集成电路的封装是指安装半导体集成电路芯片的外壳，这个外壳不仅有安放，固定，密封，保护芯片和增加电热性能的作用；而且还能沟通芯片内部世界与外部电路的桥梁。集成电路是当今信息技术产业高速发展的的基础和原动力，已经渗透到融合国民经济和社会发展的每个领域，其技术水平和发展规模已成为衡量一个国家综合产业竞争力和综合国力的重要标志之一。

集成电路模塑封装机的液压系统一般包括两个过程，第一个过程是合模，就是上下模的夹紧和固定。第二个过程就是模塑，一般模塑是指在高温、高压条件下，使环氧树脂复合材料经流道注入符合封装外形要求的金属模腔内，固化成形。就是投料，使其固化成形的过程。

随着科技技术的不断发展，液压系统也在飞速的发展，其应用领域也在不断的扩大。随着应用范围的扩大和技术的进步，各应用领域对液压系统提出了越来越高的要求，液压设备技术性能的优劣在很大程度上取决于系统设计的合理与否。液压系统在设计的过程中，一般要先查阅参考文献，在参考相关资料的前提下，设计出自己液压原理图；第二步是集成快的设计和各种液压阀的选用。也包括电动机的设计和选用；第三步则是在设计好底座和顶盖之后，进行集成块的组装；最后一步就是总的组装图。

关键词：集成电路；模塑封装；液压系统

IC packaging molding machine hydraulic system

ABSTRACT

Along with the rapid development of electronic technology, integrated circuit package is widely used in home appliances, automotive and aerospace and other fields, integrated circuit encapsulation refers to the casing for mounting semiconductor integrated circuit chip, the shell not only placed, fixed, sealing, protection chip and increase the electric performance, and can communication chip internal world and the external circuit of the bridge.IC is the basis and driving force in today's information technology industry, the rapid development of fusion has penetrated into every field of economic and social development, its technical level and scale of development has become a measure of a country's comprehensive industrial competitiveness and an important indicator of overall national strength one.

IC packages and the molding machine hydraulic system includes two processes. The first process is clamping mould clamping and fixed. The second process is molded is, general molding is refers to in high temperature, high-pressure conditions, the epoxy resin composite materials by flow injection character outline package requirements of the metal mold cavity and solidification is feeding, the solidification process.

Under the premise of the pros and cons of technical progress with science and technology unceasing development, the hydraulic system is also in the rapid development, its application field is constantly expanding. Along with the application scope of the expansion and technology, the application field of the hydraulic system is put forward more and more high requirements, hydraulic equipment performance to a large extent depends on the system design is reasonable or not. The hydraulic system in the design process, the general must first consult literature, in reference to the related data, the design of their hydraulic principle diagram; the second step is to integrate the design and various hydraulic valve selection. Including motor design and selection; the third step is in the design of good base and a top cover.

Keywords: IC; molded package; hydraulic system

目 录

前 言 - 1 -

1 设计简介及任务 - 2 -

1.1 设计内容及要求 - 2 -

1.1.1 题目名称：集成电路模塑封装机液压系统设计 - 2 -

1.1.2 设计要求 - 2 -

1.2 液压传动与控制的优缺点 - 2 -

1.2.1 主要优点 - 2 -

1.2.2 主要缺点 - 2 -

1.3 液压系统的组成及原理 - 3 -

1.3.1 液压系统的组成 - 3 -