摘 要

微尺寸多通道内的两相流传热结构经济紧凑。许多仪器装置或电子元器件的热传递管理大大影响着装置和元器件的安全稳定的运行。两相多通道微尺寸狭缝因具有良好的热传递性能能够很好地控制重要装置及电子元器件的温度而被广泛应用。同时多通道微尺寸狭缝的接口密封也是一个很重要的问题。微尺寸多通道流动沸腾传热有着非常广泛的实际应用意义，国内外很多研究者做了很多相关研究工作，也取得了不少的研究成果并得出了不少结论，但是对微尺寸通道内流动沸腾的机理认识依旧没有完整而充分的认识,实验结果也存在着很大的差异性。但由于其在高能流密度微电子、微机电系统、激光技术、航空航天及新材料的加工及制造这些领域有非常广泛的应用价值,所以国内外的众多研究者对微尺寸流动沸腾的研究有着强烈的兴趣和极高的重视。本文以设计建立微尺寸多通道流动沸腾实验台为目的，对微尺寸多通道流动沸腾进行了实验研究及理论分析。

关键字：流动沸腾，微尺寸，多通道，两相流，换热特性；

The main structure design of flow boiling

ABSTRACT

The heat transfer structure of two-phase flow in micro size and multi channel is compact. The heat transfer management of many instruments, devices, or electronic components greatly affects the safe and stable operation of devices and components. Because of its good heat transfer performance, two-phase multi channel micro size slits are widely used in controlling the temperature of important devices and electronic components. At the same time, the interface seal of multi channel micro slit is also a very important problem. The size of multi channel micro flow boiling has a very wide range of practical applications of heat transfer, many domestic and foreign researchers have done a lot of research work, but also made a lot of research results and draws some conclusions, but the size of micro channel flow mechanism of boiling is still not complete and full understanding of the experimental results, there are also a great difference. But because it has very wide application value in high energy density microelectronics, MEMS, laser technology, aerospace and new materials and manufacturing of these areas, so many researchers at home and abroad have a strong interest in research on the size of micro flow boiling and high attention. In this paper, the experimental investigation and theoretical analysis of microscale multi-channel flow boiling are carried out with the purpose of designing a micro scale multi-channel flow boiling test-bed.

Keyword: Flow boiling; Microscale; Multichannel; two phase flow; Heat transfer characteristics;

目录

1绪论·······································································1

1.1课题的研究背景及意义···················································1

1.2国内外实验研究的现状···················································1

1.2.1现有微尺寸通道的判别标准···········································1

1.3课题研究的目的和内容···················································3

1.3.1课题研究的目的·····················································3

1.3.2课题研究的内容·····················································3

2微通道芯片的结构设计与制作方式·············································4

2.1概论···································································4

2.1.1微通道芯片的设计···················································4

2.2硅微尺寸通道芯片的制作方式·············································5

2.2.1反应离子刻蚀微尺寸通道芯片轮廓图案 ································6

2.2.2深度反应离子刻蚀微尺寸通道芯片深度 ································7

3流动沸腾实验台结构及实验系统设计···········································9

3.1实验台的结构设计·······················································9

3.1.1实验台各部分形态及材料·············································9

3.1.2实验台安装方法····················································11

3.2实验系统及装置的设计··················································12

3.2.1实验段装置系统····················································12

3.3本章小结······························································14

4实验研究与误差分析························································15

4.1实验方法和步骤························································15

4.2误差分析······························································16

4.2.1实验过程中装备性能所带来的误差····································16

5结论与展望································································17

5.1本文研究结论··························································17

5.2对未来的展望··························································17

参考文献····································································18

致谢········································································19

第一章 绪论

1.1课题的研究背景及意义

自上世纪80年代开始，随着现代科技的飞速发展，科学技术向着微、小型化方向发展以及电子封装技术的快速提高，尤其是随着微电子机械系统（MEMS）加工技术的出现与应用，各种传统装备的小型化与微型化慢慢可以为现实。例如微型传感器、微型制动器、微型喷管、微型喷气发动机等装备层出不穷，紧接着的是各高新技术领域中电子设备和元器件能量密度的持续增加和对微电子机械系统（MEMS）系统中元件驱动、控制的有效实现所带来的严峻挑战，传统的散热形式和机械控制方式己无法满足完整的使用需要。例如，随着特大规模集成电路技术的飞速发展，以及微细加工工艺的不断进步，每一块芯片上的集成组件数量己经高达10⁷～10⁹ 个^[1]。因此,全面了解微小尺寸装备在特定时空范围内的热行为,己经成为提高散热装置性能最最重要的一个环节，并且对高能流密度微电子、激光技术等的发展以及加工某些新材料有着非常重要的意义^[2]。

目前的研究表明微尺寸通道流动沸腾换热特性能够很好的满足微设备在散热性能方面的要求,同时微尺寸通道流动沸腾不仅可以达到较高的换热效果,而且使用时所用工质的相变潜热可以用来保持器件的温度，让器件保持在一个稳定的安全温度之内,从而解决了因温度差异和温度超限对元器件工作的稳定性、可靠性产生的不良影响。